The logo of Samsung Electronics is seen at its office building in Seoul, South Korea. (Photo: VNA)

The investment, which will be executed in stages until 2023, is intended to actively respond to growing demand for package substrates due to the development of more powerful semiconductors and market growth. It is also designed to help expand the company's presence in high value-added product markets in the long term.

Samsung plans to strengthen its capabilities to respond to customers’ demand by dedicating the Vietnamese corporation to production of FC-BGA, while making its Suwon and Busan plants in Korea focus on technology development and high-end products.